Ceramic Package
The product is designed and produced using multi-layer ceramic lamination printing technology, high-temperature co firing and welding of metals and ceramics, while meeting the requirements of high-frequency design and thermal design. Equipped with good mechanical support and airtight protection.

Sip Package
Functional SIP system integrated packaging shell composed of multiple complex materials and temperature gradients through multiple interdisciplinary technologies.Multi chip wafer level packaging

Metal glass package

Metal glass packaging is commonly used in hybrid integrated circuits, microwave devices, filter devices, optoelectronic devices, sensor devices, high-power devices, etc. The product is widely used in the fields of aerospace, aviation, weapons, ships, electronics, and optical communication.