4Steps HDI+Depth Routing board
4Steps HDI+Depth Routing board
Layer                               14L (4+5+4)
Material                               IT-180A
Board thickness              1.6±0.16mm
Min line width/space:      0.076 mm/ 0.076 mm
Surface treatment               ENIG

ATE Probe Card
ATE Probe Card
Layer                         8L
Material                         IT180A
Board thickness        3.93±0.39mm
Min line width/space:   0.15 mm/ 0.15 mm
Surface treatment         ENIG+Hard Gold

100G/400G Optical Module board
100G/400G Optical Module board
Layer                             8L
Material                        M6+IT180A
Board thickness            1.0±0.1mmmm
Min line width/space:    0.15 mm/ 0.15 mm
Surface treatment           ENIG

FC-CSP
FC-CSP
Layer                              10L  (4+2+4)
Material                               HL832N
Board thickness                 0.75±0.1mm
Min line width/space:       0.015 mm/ 0.060 mm
Surface treatment               Plating Solt Au

10 layers Rigid-Flex board
10 layers Rigid-Flex board
Layer                         10L (4R+2F+4R)
Material                         AP8525+S1000-2M
Board thickness         1.6±0.16mm
Min line width/space:    0.1 mm/ 0.1 mm
Surface treatment          ENIG